Quality in Printed Circuit Board Assembling

The printed circuit board (PCB) assembing process includes a number of steps, each crucial to the quality of the finished product. Many of these steps require specialized equipment that can ensure all components have been properly placed and that the solder joints are of high quality.

Visual inspection is one of the most commonly used methods for detecting printed circuit board assembly defects. It involves examining the board for issues such as contaminated solder paste and missing components. Despite its usefulness, visual inspection can be unreliable, due to factors such as the inspector’s skill level and the consistency of the inspection standards. This makes it ineffective for quantitative structural process control.

X-ray fluoroscopic inspection is also an effective method for detecting soldering defects. This type of inspection works by using a single-point X-ray source to produce an image of the solder joint density. It is particularly useful for detecting solder bridges, voids, misalignment, and other hidden defects that cannot be detected with optical inspections.

How Are Solder Joints Inspected For Quality in Printed Circuit Board Assembling?

Another effective method for inspecting PCB soldering quality is by using a computer-aided detection system. These systems use a computer to examine the image and identify potential defects. This technology is especially helpful for detecting soldering defects in complex boards with multiple layers. It can even detect problems that would be difficult for human inspectors to notice, such as oxidized solder or non-metallic impurities.

Soldering defects can arise from many causes, including poor practice by the PCB assembler, low-quality solder, and faulty equipment. In some cases, mechanical stress during handling can cause the solder joints to crack or loosen. Other factors can include a poorly designed PCB or a manufacturing process that does not adhere to the PCB specifications.

When a defect is detected, the PCB assembler must be able to quickly identify the issue and fix it before proceeding with production. This requires an advanced soldering inspection system that is able to detect and pinpoint defects with high accuracy. Altest offers a variety of automated inspection solutions to help clients meet their production goals. These include a Design for Manufacturing check, pin indications, footprint corroboration, and BOM verification just to name a few.

Soldering defects can impact the reliability of a printed circuit board, but they do not have to be a problem. By implementing the proper inspection system, you can guarantee that your printed circuit boards will be of the highest quality. Contact Altest today to get started on your next project. Our experts will provide you with a free DFM check and quick turnaround time so that your project can be completed on schedule.